Cooling Solutions
קטגוריית
Cooling Solutions
CPU fan
Cooling Solutions
דף הבית » product catalog » Cooling Solutions » Page 3
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FAN B11 DYNATRON FCLGA 3647 SOCKETS
- Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for 3U Server and up, 80x80x25 mm PWM Fan, Support CPU power up to 205 Watts heat dissipation.
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FAN B16 DYNATRON FCLGA 3647 SOCKETS
- Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for 1U Server, Support CPU power up to 205 Watts heat dissipation.
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FAN A31 DYNATRON
- Recommend for AMD® Ryzen Threadripper Processor, Socket sWRX8, sTRX4 and TR4, and AMD® Epyc Processor Socket SP3, 8013 Aluminum PWM Blower for Heat Exhausting, Active Cooler for 1U Server, Support CPU power up to 225 Watts Heat Dissipation.
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FAN B9 DYNATRON
- Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Active Cooler for 1U Server and up, Ø90 x 15 mm 9015 Aluminum Frame PWM Blower for Heat Exhausting, Support CPU power up to 205 Watts heat dissipation.
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FAN R31 DYNATRON
- Vapor chamber base with Aluminum stacked fin up to TDP 165 Watts for 1U server solution.
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FAN B4A DYNATRON
- Recommend for Intel® Xeon® Platinum / Gold Family Processor( products formerly Skylake ), Socket FCLGA3647 Narrow ILM copper stacked fin with vapor chamber base heatsink for 1U Server up to CPU power 205 Watts.
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FAN K5 DYNATRON
- Recommend for Intel® Socket LGA 1150, LGA 1151, LGA 1155, LGA 1156, and LGA 1200, Active Cooler for Chassis Height 1.5U & Up (> 2.7 Inch). Support 125 Watts CPU Power Heat Dissipation.
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FAN V31G DYNATRON
- Recommend for Motherboard and Graphic Card Chipsets Application, Active Cooler for Chassis Height 1U & Up. Stylish active chipset cooler with quiet 50x50x10mm fan 2pin connector for GPU Solution
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FAN K987 DYNATRON
- Recommend for Intel® Socket LGA 775, LGA 1366, LGA 1356, LGA 1150, LGA 1151, LGA 1155, LGA 1156, and LGA 1200, 92×25 mm Fan with PWM Function, Aluminum Radial Fin Heatsink with Copper Inserted, Support 125 Watts CPU Power Heat Dissipation for Desktop, 3U&Up.
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FAN A34 DYNATRON
- Recommend for AMD® Ryzen Threadripper Processor, Socket sWRX8, sTRX4 and TR4, and AMD® Epyc Processor Socket SP3, Aluminum Stacked Fin with Heatpipe Embedded, Passive Cooler for 2U Server and up, Support CPU power up to 180 Watts Heat Dissipation.
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FAN DYNATRON N8
- Recommend for Intel® Whitley Platform Ice Lake and Cooper Lake Server Processor, LGA 4189-4 / -5 Socket ( Socket P4 / P5 or P+ ), Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up. Support 270W CPU powered heat dissipation. CPU Support: Intel CPU Socket: FCLGA4189-4/5(Socket P4/P5 or P+) APPLICATION: 2U&UP
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FAN DYNATRON Q3
- Recommend for Intel® Alder Lake S Processor, Socket LGA 1700, Copper Heatsink with Skiving Fins. Support 125 Watts CPU Power Heat Dissipation for 1U&Up Server Solution. CPU Support: Intel CPU Socket: LGA1700 APPLICATION: 1U
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